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Peking University unveils 3D design tool to power Huawei’s chip ambitions
ASIA
🇨🇳 ChinaMay 27, 2026

Peking University unveils 3D design tool to power Huawei’s chip ambitions

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Originally published bySouth China Morning Post
Researchers at Peking University have claimed a breakthrough in microchip design software, purportedly offering critical support to Huawei Technologies as the tech giant attempts to build cutting-edge semiconductors despite US-led trade restrictions. The innovation, unveiled on Tuesday, comes in the form of a prototype tool for electronic design automation (EDA), according to an announcement by the university’s School of Integrated Circuits. EDA is the highly specialised software that engineers...

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